What Are The Advantages Of PVD (Physical Vapour Deposition) Technology?

PVD (Physical Vapour Deposition) is under vacuum conditions, used the physicochemical method vaporized the surface of the material source(solid or liquid) into gaseous atoms, molecules or ionized to ions, and through low pressure gas process, then deposit a thin film with a specific function on the surface of the component.

The main methods of PVD are vacuum evaporation, sputter coating, arc plasma coating, ion coating, and molecular beam epitaxy. Up to now, PVD technology can not only deposit metal films, alloy films, but also compounds, ceramics, semiconductors, polymer films and so on.

The advantages of PVD technology are:

1. Metal appearance, various colors, uniform surface effect, not easy to fade.
2. Stable chemical properties, corrosion resistance, oxidation resistance, acid resistance.
3. The film has high adhesion and durability.
4. The film is thin, but the hardness is high, not easy to scratch, wear resistance, scratch resistance.
5. It can be etched any pattern.
6. PVD film can be plated with a wide range of materials and has a strong binding force with the substrate.
7. Economic and practical, can reduce the time and cost of cleaning and polishing.
8. Harmless to human body and the environment, avoid chemical poisoning.
9. Widely used, can be applied to aerospace, high temperature resistance, high pressure, wear resistance parts, tool mold, daily hardware, 3C electronic accessories, architectural decoration, electrical electronics, medical and other industries.